LED Totem
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Outstanding Sunlight Visibility
With 3000 nits of brightness and an anti-UV black coating, the content remains easily viewable even in direct sunlight.
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Die-cast aluminum
Our die-cast aluminum shells safeguard both the module and power box, ensuring superior protection against damage.
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Energy saving
Under the same brightness conditions, the TOTEM saves more than 30% energy over the traditional SMD.
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Technology: COB Flip-chip
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Chip On Board (COB) technology mounts the light-emitting chip directly onto the PCB board. This method effectively eliminates pixel failure issues caused by rack pins.
Unlike the traditional SMD package, COB technology bypasses the complex processes of LED chip fabrication and reflow soldering. This significantly enhances the stability of the lamp beads and provides superior protection.
Furthermore, COB requires no wire connections, thus preventing pixel failures that can result from connector detachment and poor soldering quality.